This paper investigates an advanced grating-transferring technique combined with geometric phase analysis (GPA) for residual strain evaluation of curved surface.A standard holographic grating is first transferred to a pre-produced epoxy resin film and then consolidated to a test region of curved surface.With a rubber mold and silicone rubber the deformed grating is replicated to a sheet metal after hole-drilling for release of residual stress.After that the grating is transferred from the sheet metal to the glass plate,which would be served as an analyzer grating (specimen grating).By GPA the local strain distributions related to the phase difference between the reference grating and analyzer grating for the released stress can be evaluated.A validation test has been conducted on the weld joint of a stainless steel tube and the obtained results demonstrate the ability of the method in measuring the residual strain of curved surface.
Zhanwei Liu,1,Jiangfan Zhou,1 Xianfu Huang,1 Jian Lu,2 and Huimin Xie 3,1) Department of Mechanics,School of Astronautics,Beijing Institute of Technology,Beijing 100081,China 2) Department of Mechanical Engineering,The Hong Kong Polytechnic University,Hong Kong,China 3) AML,Department of Engineering Mechanics,Tsinghua University,Beijing 100084,China
Residual stress evolution regularity in thermal barrier ceramic coatings （TBCs） under different cycles of thermal shock loading of 1 100℃ was investi- gated by the microscopic digital image correlation （DIC） and micro-Raman spec- troscopy, respectively. The obtained results showed that, as the cycle number of the thermal shock loading increases, the evolution of the residual stress under- goes three distinct stages： a sharp increase, a gradual change, and a reduction. The extension stress near the TBC surface is fast transformed to compressive one through just one thermal cycle. After different thermal shock cycles with peak temperature of 1 100℃, phase transformation in TBC does not happen, whereas the generation, development, evolution of the thermally grown oxide （TGO） layer and micro-cracks are the main reasons causing the evolution regularity of the residual stress.
Residual stress measurement is of critical significance to in-service security and the reliability of engineering components, and has been an active area of scientific interest. This paper offers a review o[ several prominent mechanical release methods for residual stress measurement and recent developments, focusing on the hole-drilling method combined with advanced optical sensing. Some promising trends for mechanical release methods are also analyzed.
